| Semiconductor & Photovoltaic equipment
Our offices in China, Taiwan, and USA.
Products include Grinding & Measurement Solutions:
Hennecke - NO.1 market share in Europe and China
Solar Wafer Metrology Sorter
- Thickness, TTV, Warp, Dimensions, Edge Chip, Saw Mark, Resistivity, Life time
G&N - Spacialty Process for Silicon Brick
Grinding Machine
- Si, GaAs, III-V, Sapphire, Solar
- Mono /Multi Crystalline Silicon Brick Grinder
E+H - NO.1 market share in IC Assembly and Wafer Reclaim
Wafer Geometry Gauge
- Non-Contact
- Ultra-thin Wafer!!
(Thickness, TTV, Warp/BOW, Stress)
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PhotoVoltaic Specialty Process
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Wafer Yield increase 3% more at Multi-Wire Saw
Please contact Mr. J. C. Lin for more information.
Mr. J. C. Lin / General Manager
Mobile Phone: +86-13818977119, +886-922-862669
TEL:+86-21-6251-5152
FAX:+86-21-6212-7410
E-mail: jclin@semicare.com
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